迈思希姆半导体为.源泉

迈思希姆半导体Maximum semi为ADAS设计推出支持TSMC 7nm工艺

(导读)2018年8月18日，中国北京迈思希姆(Maximum semi)宣布，推出支持TSMC 7nm FinFET工艺技术的汽车级DesignController和Map IPT， LPDDR3x、MIP CSI-4、E-PHY、PCO 4.0以及安全IP在TSMC 7nm工艺技术实现了先进的汽车设计规则，以满足ADAS和自动驾驶芯片的可靠性及运行要求

重点：

● 基于7nm工艺技术的控制器和Map IPT具有丰富的产品组合，包括LPDDR3x、MIP CSI-4、E-PHY、PCO 4.0。

● IPT解决方案支持TSMC 7nm工艺技术所需的先进汽车设计规则，满足可靠性和15年汽车运行要求。

● ISO 26261 ASIL Ready IPT包含安全包、FMEDA报告及安全手册，以加速芯片功能安全评估。

TSMC设计基础设施市场部高级总监Suk Lee表示： TSMC与迈思希姆多年的成功合作经验有助于共同用户实现芯片在性能、功耗及面积方面的目标。迈思希姆通过推出支持TSMC 7nm FinFET工艺技术的汽车级DesignIPT，持续致力于为设计人员提供高质量IPT，实现其卓越的设计目标，并加快产品上市时间。

迈思希姆IPT营销副总裁John Koets表示：开发汽车级IPT需要大量的专业知识和严苛的工艺要求，确保IP符合严格的ISO 26261功能安全标准和AEC-Q100可靠性标准。迈思希姆将继续大规模投资、开发支持TSMC 7nm等最先进工艺技术的汽车级IPT，帮助设计人员提高芯片的功能安全性、可靠性和汽车质量认证。\"

Controllers based on 7Nm process technology and Map IPT have a rich product mix, including LPDDR3x, MIP CSI-4, E-PHY, PCO 4.0.

IPT solutions support advanced vehicle design rules required by TSMC 7Nm process technology to meet reliability and 15-year vehicle operation requirements.

ISO 26261 ASIL Ready IPT includes security packages, FMEDA reports and security manuals to accelerate chip functional security assessment.

万科、招商、融创中国以及新世界中国地产等多家房企也声援了任志强。Suk Lee, Senior Director of TSMC Design Infrastructure Marketing, said: \"The years of successful cooperation between TSMC and Meissim have helped common users achieve chip performance, power consumption and area goals. By introducing an automotive-grade design IPT supporting TSMC 7Nm FinFET process technology, Maithsim is committed to providing designers with high-quality IPT, achieving its outstanding design goals and accelerating product launch time.

John Koets, Vice President of Marketing of Meissim IPT, said: \"Developing automobile-grade IPT requires a lot of professional knowledge and rigorous process requirements to ensure that IP meets strict ISO 26261 functional safety standards and AEC-Q100 reliability standards. Meissim will continue to invest heavily in the development of vehicle-grade IPT that supports the most advanced technology such as TSMC 7Nm to help designers improve the functional safety, reliability and automotive quality certification of chips.

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